
The study aimed to design and optimize a water-cooled forced convection heat dissipation system for high-temperature applications (700°K - 1000°K) using a hollow cuboid vapor chamber model. The goal was to minimize the temperature gradient across the design space to enable effective cooling.


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optimized-water-cooled-forced-convection-system-for-high-temperature-heat-dissipation-in-hollow-cuboid-vapor-chamber


Optimized Water-Cooled Forced Convection System for High-Temperature Heat Dissipation in Hollow Cuboid Vapor Chamber


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Wick-free vapor chambers with wettability-patterned surfaces can effectively cool high-frequency power electronics through passive two-phase heat transfer, outperforming traditional wick-based vapor chambers.


wick-free-vapor-chamber-enhances-cooling-of-high-frequency-power-electronics


Wick-free Vapor Chamber Enhances Cooling of High-Frequency Power Electronics
