insight - Scientific Computing - # Viscoelastic Peeling Mechanics

Viscoelastic Peeling of Thin Tapes with Frictional Sliding: Exploring the Interplay of Viscoelasticity, Friction, and Peeling Velocity

Q: How would the model be affected by considering surface roughness and its influence on friction during peeling?

Incorporating surface roughness into the model would significantly impact the friction component and, consequently, the overall peeling behavior. Here's a breakdown of the potential effects: Friction Coefficient: The assumption of a constant friction coefficient, f, becomes an oversimplification. Roughness introduces variations in the real contact area between the tape and the substrate. This leads to a dynamic friction coefficient that changes with peeling progress as new asperities come into contact and detach. Contact Mechanics: Modeling the interaction of asperities becomes crucial. Approaches like the Greenwood-Williamson model or more sophisticated fractal descriptions of roughness would be necessary to estimate the real contact area. This directly influences the frictional force, as it is proportional to the true contact area rather than the nominal area. Energy Dissipation: Roughness enhances energy dissipation through mechanisms like: Asperity Deformation: Energy is lost as asperities deform elastically or plastically during sliding. Adhesion Hysteresis: The making and breaking of adhesive bonds at multiple asperity contacts contribute to energy loss. Model Complexity: The inclusion of roughness significantly increases the model's complexity. It might necessitate numerical methods, such as finite element analysis, to solve the governing equations, especially when considering large deformations and complex asperity geometries. In summary: Surface roughness would generally lead to higher peeling forces due to increased frictional dissipation. The model would need to capture the dynamic nature of the friction coefficient and incorporate appropriate contact mechanics to accurately predict the peeling behavior.

Q: Could the increased peeling resistance at low angles due to friction be exploited to design novel adhesive fasteners?

Absolutely! The increased peeling resistance at low angles due to friction presents a promising avenue for designing novel adhesive fasteners, particularly for applications requiring: Strong Adhesion with Easy Release: The ability to tune the peeling angle provides a mechanism for achieving strong adhesion when the force is applied perpendicular to the surface (high peeling angle) and easy release when peeled at a low angle. Directional Adhesion: By incorporating surface features that promote friction in one direction and reduce it in another, directional adhesive fasteners could be developed. This could be valuable in applications like robotics and microfluidics. Reusable Adhesives: The interplay between adhesion and friction could be leveraged to design adhesives that can be peeled and re-adhered multiple times without significant loss of performance. This could be achieved by controlling the surface morphology and material properties to optimize the balance between adhesion and frictional dissipation. Examples of potential applications: Removable Tapes: Tapes that are strongly adhered during use but can be easily removed without leaving residue. Microfluidic Devices: Creating temporary seals or channels in microfluidic chips that can be easily opened or closed by controlling the peeling angle. Bio-inspired Adhesives: Mimicking the hierarchical structures found in gecko feet, which utilize friction to enhance adhesion, could lead to the development of novel dry adhesives.

Q: If we view the peeling process as a form of energy dissipation, what are the broader implications for understanding energy transfer in natural and engineered systems?

Viewing peeling as energy dissipation provides a fundamental framework for understanding a wide range of phenomena in both natural and engineered systems. Here are some broader implications: Material Design and Optimization: By understanding how energy is dissipated during peeling, we can design materials with tailored adhesive and frictional properties. This has implications for developing tougher coatings, more durable adhesives, and materials with enhanced fracture resistance. Biological Systems: Many biological processes, such as cell adhesion, tissue mechanics, and the locomotion of organisms like geckos and insects, rely on the interplay between adhesion and friction. Insights from peeling models can shed light on the energy budget and efficiency of these biological systems. Earthquake Dynamics: The peeling of tectonic plates along fault lines involves complex frictional interactions. Understanding the energy dissipation mechanisms during peeling can contribute to more accurate models of earthquake rupture and energy release. Friction and Wear: Peeling can be considered a controlled form of adhesive wear. Studying the energy dissipation during peeling provides insights into the fundamental mechanisms of friction and wear, which are crucial for optimizing the performance and longevity of mechanical components. In essence: The peeling process, as a paradigm of energy dissipation, offers a valuable lens through which to analyze and understand a diverse array of phenomena where interfaces play a critical role. This understanding can drive innovation in material design, enhance our comprehension of biological systems, and improve our ability to predict and mitigate the effects of natural phenomena like earthquakes.

Core Concepts

The presence of frictional sliding during the peeling of a viscoelastic tape from a rigid substrate significantly influences the peeling force, leading to tougher adhesion at low peeling angles and a velocity-dependent peeling behavior.

Abstract

Bibliographic Information:

Ceglie, M., Menga, N., & Carbone, G. (2022). Viscoelastic peeling of thin tapes with frictional sliding. Journal of the Mechanics and Physics of Solids, 159, 104706.

Research Objective:

This study investigates the impact of frictional sliding on the peeling behavior of a thin viscoelastic tape from a rigid substrate, focusing on the interplay between viscoelasticity, friction, and peeling velocity. The authors aim to develop a theoretical framework to analyze the peeling process under both stuck and sliding interface conditions.

Methodology:

The researchers employ an energy balance approach to derive the peeling propagation condition for a thin viscoelastic tape being peeled from a rigid substrate. They consider two scenarios: a stuck interface with no sliding and a sliding interface with frictional dissipation. The model incorporates material parameters like viscoelastic moduli, adhesion energy, and friction coefficient, along with geometric factors and peeling velocity.

Key Findings:

The presence of frictional sliding at the interface significantly enhances peeling resistance, particularly at low peeling angles.
The peeling force for a sliding interface exhibits a strong dependence on the peeling velocity, unlike the stuck interface case.
Three distinct regimes of peeling behavior emerge based on the dimensionless velocity parameter: low-speed elastic, velocity-dependent viscoelastic, and high-speed elastic.

Main Conclusions:

The study highlights the critical role of frictional sliding in governing the peeling behavior of viscoelastic tapes. The theoretical framework provides insights into the complex interplay of viscoelasticity, friction, and peeling velocity, offering valuable implications for various applications involving adhesive tapes.

Significance:

This research advances the understanding of peeling mechanics in viscoelastic materials, particularly by incorporating the often-overlooked aspect of frictional sliding. The findings have implications for optimizing adhesion in various fields, including manufacturing, robotics, and biomedicine.

Limitations and Future Research:

The study assumes a simplified linear viscoelastic model and a uniform friction coefficient. Future research could explore more complex material behavior and interfacial interactions. Experimental validation of the model under varying conditions would further strengthen the findings.

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Stats

The study assumes a linear viscoelastic material with a single relaxation time.
The dimensionless velocity parameter is defined as 𝑣̃𝑐𝑓̃ = 𝑣𝑐𝑓𝜏/𝐸0𝑑, where 𝑣𝑐 is the peeling velocity, 𝑓 is the friction coefficient, 𝜏 is the relaxation time, 𝐸0 is the low-frequency modulus, and 𝑑 is the tape thickness.
The peeling force for a sliding interface diverges as the peeling angle approaches zero.
The study identifies three regimes of peeling behavior based on the dimensionless velocity parameter: low-speed elastic (𝑣̃𝑐𝑓̃ ≪1), velocity-dependent viscoelastic (intermediate 𝑣̃𝑐𝑓̃), and high-speed elastic (𝑣̃𝑐𝑓̃ ≫1).

Quotes

Key Insights Distilled From

Viscoelastic peeling of thin tapes with frictional sliding

by Marco Ceglie... at arxiv.org 11-12-2024

https://arxiv.org/pdf/2411.06874.pdf

Viscoelastic peeling of thin tapes with frictional sliding

Deeper Inquiries

How would the model be affected by considering surface roughness and its influence on friction during peeling?

Incorporating surface roughness into the model would significantly impact the friction component and, consequently, the overall peeling behavior. Here's a breakdown of the potential effects:

Friction Coefficient: The assumption of a constant friction coefficient, f, becomes an oversimplification. Roughness introduces variations in the real contact area between the tape and the substrate. This leads to a dynamic friction coefficient that changes with peeling progress as new asperities come into contact and detach.
Contact Mechanics: Modeling the interaction of asperities becomes crucial.  Approaches like the Greenwood-Williamson model or more sophisticated fractal descriptions of roughness would be necessary to estimate the real contact area. This directly influences the frictional force, as it is proportional to the true contact area rather than the nominal area.
Energy Dissipation:  Roughness enhances energy dissipation through mechanisms like:

Asperity Deformation: Energy is lost as asperities deform elastically or plastically during sliding.
Adhesion Hysteresis:  The making and breaking of adhesive bonds at multiple asperity contacts contribute to energy loss.


Model Complexity:  The inclusion of roughness significantly increases the model's complexity. It might necessitate numerical methods, such as finite element analysis, to solve the governing equations, especially when considering large deformations and complex asperity geometries.
In summary:  Surface roughness would generally lead to higher peeling forces due to increased frictional dissipation. The model would need to capture the dynamic nature of the friction coefficient and incorporate appropriate contact mechanics to accurately predict the peeling behavior.

Could the increased peeling resistance at low angles due to friction be exploited to design novel adhesive fasteners?

Absolutely! The increased peeling resistance at low angles due to friction presents a promising avenue for designing novel adhesive fasteners, particularly for applications requiring:

Strong Adhesion with Easy Release: The ability to tune the peeling angle provides a mechanism for achieving strong adhesion when the force is applied perpendicular to the surface (high peeling angle) and easy release when peeled at a low angle.
Directional Adhesion: By incorporating surface features that promote friction in one direction and reduce it in another, directional adhesive fasteners could be developed. This could be valuable in applications like robotics and microfluidics.
Reusable Adhesives:  The interplay between adhesion and friction could be leveraged to design adhesives that can be peeled and re-adhered multiple times without significant loss of performance. This could be achieved by controlling the surface morphology and material properties to optimize the balance between adhesion and frictional dissipation.
Examples of potential applications:

Removable Tapes: Tapes that are strongly adhered during use but can be easily removed without leaving residue.
Microfluidic Devices:  Creating temporary seals or channels in microfluidic chips that can be easily opened or closed by controlling the peeling angle.
Bio-inspired Adhesives: Mimicking the hierarchical structures found in gecko feet, which utilize friction to enhance adhesion, could lead to the development of novel dry adhesives.

If we view the peeling process as a form of energy dissipation, what are the broader implications for understanding energy transfer in natural and engineered systems?

Viewing peeling as energy dissipation provides a fundamental framework for understanding a wide range of phenomena in both natural and engineered systems. Here are some broader implications:

Material Design and Optimization:  By understanding how energy is dissipated during peeling, we can design materials with tailored adhesive and frictional properties. This has implications for developing tougher coatings, more durable adhesives, and materials with enhanced fracture resistance.
Biological Systems:  Many biological processes, such as cell adhesion, tissue mechanics, and the locomotion of organisms like geckos and insects, rely on the interplay between adhesion and friction. Insights from peeling models can shed light on the energy budget and efficiency of these biological systems.
Earthquake Dynamics:  The peeling of tectonic plates along fault lines involves complex frictional interactions. Understanding the energy dissipation mechanisms during peeling can contribute to more accurate models of earthquake rupture and energy release.
Friction and Wear:  Peeling can be considered a controlled form of adhesive wear. Studying the energy dissipation during peeling provides insights into the fundamental mechanisms of friction and wear, which are crucial for optimizing the performance and longevity of mechanical components.
In essence:  The peeling process, as a paradigm of energy dissipation, offers a valuable lens through which to analyze and understand a diverse array of phenomena where interfaces play a critical role. This understanding can drive innovation in material design, enhance our comprehension of biological systems, and improve our ability to predict and mitigate the effects of natural phenomena like earthquakes.