Chen, M., Wang, C., Jia, K., Tian, X.-H., Tang, J., Zhu, C., Gu, X., Zhao, Z., Wang, Z., Ye, Z., Tang, J., Zhang, Y., Yan, Z., Qian, G., Jin, B., Wang, Z., Zhu, S.-N., & Xie, Z. (2024). High-gain optical parametric amplification with continuous-wave pump using domain-engineered thin film lithium niobate waveguide. Optica, 11(1), 68–75.
This research paper presents the development and characterization of a high-gain optical parametric amplifier (OPA) fabricated on a thin-film lithium niobate (TFLN) chip, aiming to address the challenge of on-chip signal amplification for integrated optical communication circuits.
The researchers employed a cascaded second-harmonic generation (SHG) and OPA process in an x-cut domain-engineered TFLN waveguide. This indirect pumping scheme simplifies the coupling design and enables deterministic excitation of the pump light. The team utilized deep-ultraviolet (DUV) lithography for wafer-scale fabrication and implemented ion-beam trimming to minimize thickness variations in the TFLN wafer, ensuring consistent phase-matching and high nonlinear efficiency. An etching-prior-poling process was adopted to reduce optical losses, further enhancing the OPA performance.
The fabricated OPA device demonstrated a high on-chip parametric gain of up to 13.9 dB with a broad 10-dB bandwidth of 110 nm, covering both C and L bands at telecom wavelengths. The device exhibited a high signal-to-noise ratio (SNR) exceeding 28 dB across various optical bandwidth settings. Importantly, the OPA successfully amplified modulated signals from commercial communication modules at data rates ranging from 200 to 1000 Mbps, achieving a bit error rate (BER) below 10-2.
This research highlights the successful demonstration of a high-gain, continuous-wave pumped OPA on a TFLN chip, marking a significant step towards fully integrated TFLN optical communication circuits. The device's high gain, broad bandwidth, and low BER performance make it promising for various applications in high-speed optical communication systems.
This work addresses a critical need for efficient on-chip signal amplification in integrated photonics, paving the way for compact and high-performance optical communication systems. The demonstrated fabrication techniques and device performance represent a significant advancement in TFLN-based photonics.
The current OPA device requires watt-level off-chip pump power, primarily limited by thickness variations in the TFLN wafer. Future research could focus on improving wafer uniformity or developing more efficient pumping schemes to reduce power consumption. Additionally, exploring phase-sensitive amplification (PSA) configurations could further enhance the SNR performance of the device.
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