Evaluating Alternative Metals for Advanced Interconnects: Overcoming Scaling Challenges and Reliability Concerns

核心概念

The selection of alternative metals is a critical challenge for advanced interconnects, requiring consideration of multiple criteria including resistivity at reduced dimensions, reliability, thermal performance, process technology readiness, and sustainability.

摘要

The content discusses the selection of alternative metals for advanced interconnects, which is a complex process that must address multiple criteria.

Key highlights:

• Interconnect resistance and reliability have emerged as critical factors limiting the performance of advanced CMOS circuits. As interconnect dimensions approach the 10 nm scale, the limitations of conventional Cu dual-damascene metallization are becoming increasingly difficult to overcome.
• The resistivity of metallic nanostructures can be much higher than their bulk counterparts due to surface and grain boundary scattering effects. Metals with shorter mean free paths of charge carriers are less sensitive to scaling and are potential alternatives to Cu.
• Reliability aspects, particularly time-dependent dielectric breakdown and electromigration, must also be considered in the selection of alternative metals. Refractory metals with high cohesive energies can improve dielectric breakdown lifetimes.
• The selection process involves a multistage framework including ab initio modeling, thin film experiments, narrow line resistance and scaling potential evaluation, and metallization module development.
• Sustainability is an increasingly important factor, and a life cycle assessment framework is introduced to evaluate the environmental impact of alternative interconnect metals.

统计

"Interconnect resistance and reliability have emerged as critical factors limiting the performance of advanced CMOS circuits."
"As interconnect dimensions approach the 10 nm scale, the limitations of conventional Cu dual-damascene metallization are becoming increasingly difficult to overcome."
"Metals with shorter mean free paths of charge carriers are less sensitive to scaling and are potential alternatives to Cu."
"Refractory metals with high cohesive energies can improve dielectric breakdown lifetimes."

引用

"The selection of alternative metals is a highly complex process, requiring consideration of multiple criteria, including resistivity at reduced dimensions, reliability, thermal performance, process technology readiness, and sustainability."
"Interconnect lines and vias provide signal, power, and clock to the active components of the circuits, such as complementary metal–oxide–semiconductor (CMOS) transistors or memory elements, and thus are central in microelectronic circuits and systems with advanced functionality."
"Reducing the cross-sectional area of a wire inevitably increases its resistance per unit length, resulting in greater energy dissipation and higher resistive–capacitive delay (RC-delay)."

从中提取的关键见解

Selecting Alternative Metals for Advanced Interconnects

by Jean... 在 arxiv.org 10-03-2024

https://arxiv.org/pdf/2406.09106.pdf

更深入的查询

What are the key technical and economic challenges in transitioning from Cu to alternative interconnect metals in high-volume manufacturing?

The transition from copper (Cu) to alternative interconnect metals in high-volume manufacturing (HVM) presents several key technical and economic challenges.
Technical Challenges:

Material Properties: Alternative metals must exhibit lower resistivity and better electromigration resistance than Cu, especially as interconnect dimensions shrink to sub-10 nm scales. The resistivity of metals can increase significantly at nanoscale dimensions due to surface and grain boundary scattering, which complicates the selection process.

Integration Compatibility: The integration of alternative metals into existing manufacturing processes is critical. Many alternative metals may require different deposition techniques, such as atomic layer deposition (ALD) or physical vapor deposition (PVD), which can be less mature than the established dual-damascene process used for Cu. This necessitates extensive process development and optimization.

Reliability Concerns: The reliability of alternative metals must be thoroughly evaluated, particularly regarding time-dependent dielectric breakdown (TDDB) and electromigration. The absence of diffusion barriers, which are essential for Cu, poses a risk for alternative metals, necessitating the development of new barrier materials or strategies.

Economic Challenges:

Cost of Materials: Many alternative metals, such as ruthenium (Ru) or nickel-aluminum (NiAl), may be more expensive than Cu. The economic feasibility of large-scale adoption hinges on balancing performance benefits with material costs.

Investment in Infrastructure: Transitioning to alternative metals may require significant investments in new manufacturing equipment and facilities. This includes the need for advanced characterization tools and process control systems to ensure quality and reliability.

Market Acceptance: The semiconductor industry is risk-averse, and the adoption of new materials often requires extensive validation and qualification processes. Gaining acceptance from manufacturers and customers can be a lengthy and costly endeavor.

How can the reliability of alternative metals be further improved to meet the stringent requirements of future technology nodes?

Improving the reliability of alternative metals to meet the stringent requirements of future technology nodes involves several strategies:

Material Engineering: Developing alloys or composite materials that combine desirable properties of different metals can enhance reliability. For instance, creating ordered intermetallic compounds can reduce resistivity and improve electromigration resistance compared to disordered alloys.

Barrier Layer Innovations: Research into new barrier materials that can effectively prevent metal diffusion into dielectrics is crucial. Materials with higher cohesive energies, such as refractory metals, may provide better performance in preventing time-dependent dielectric breakdown (TDDB).

Process Optimization: Fine-tuning deposition processes to control microstructure, such as grain size and orientation, can significantly impact the reliability of interconnects. Techniques like post-deposition annealing can promote grain growth, reducing grain boundary scattering and enhancing conductivity.

Reliability Testing: Implementing rigorous reliability testing protocols, including accelerated life testing and real-time monitoring of interconnect performance, can help identify potential failure modes early in the development process. This data can inform design and material choices.

Integration of Advanced Dielectrics: Utilizing low-κ dielectrics that minimize capacitance while maintaining mechanical stability can enhance the overall reliability of interconnects. The compatibility of alternative metals with these advanced dielectrics must be carefully evaluated.

What are the potential implications of adopting alternative interconnect metals on the overall sustainability and environmental impact of the microelectronics industry?

The adoption of alternative interconnect metals can have significant implications for the sustainability and environmental impact of the microelectronics industry:

Resource Utilization: Many alternative metals, such as silver (Ag) or gold (Au), are less abundant than Cu, which could lead to increased resource extraction and environmental degradation. Sustainable sourcing practices and recycling initiatives will be essential to mitigate these impacts.

Energy Efficiency: Alternative metals that exhibit lower resistivity and better thermal performance can lead to more energy-efficient devices. This reduction in energy consumption during operation can contribute to lower carbon footprints for electronic devices.

Lifecycle Assessment: Implementing a life cycle assessment (LCA) framework for interconnect metals can help evaluate the environmental impact from extraction to disposal. This assessment can guide the selection of materials that minimize ecological footprints.

Waste Management: The transition to alternative metals may necessitate new waste management strategies, particularly if these metals are more toxic or less recyclable than Cu. Developing effective recycling processes for alternative interconnect materials will be crucial to reducing electronic waste.

Regulatory Compliance: As environmental regulations become more stringent, the microelectronics industry will need to ensure that alternative metals comply with regulations regarding hazardous materials and waste. This may influence material selection and processing choices.

In summary, while the transition to alternative interconnect metals presents challenges, it also offers opportunities for enhancing the sustainability and environmental performance of the microelectronics industry.