Core Concepts
The author presents a reduced order model based on equations applicable to heat transfer simulations in power electronics systems, aiming to improve computational efficiency and accuracy.
Abstract
The content introduces a transient thermal model for power electronics systems using reduced order equations. The model is designed to simulate heat transfer scenarios involving conduction, natural and forced convection problems. By reducing complex simulations to a few parameters, the model enhances computation speed and enables quick evaluation of thermal performance. The approach is validated through case studies in Ansys® Icepak™, showing high accuracy compared to simulations.
The models progress from single-body insulated systems to multi-body configurations with mixed modes of heat transfer. The equations consider factors like thermal capacitance, power input, and spatial gradients to accurately predict temperature evolution. The study also addresses convection heat transfer, providing insights into modeling solid bodies in fluid mediums.
Furthermore, the content discusses the estimation of thermal resistances and time constants for multi-body systems through parametric studies. It highlights the importance of accurate modeling for transient systems with rapidly changing inputs. The results demonstrate the effectiveness of the proposed models in capturing temperature variations across different configurations.
Overall, the research emphasizes the significance of reduced order models in optimizing thermal simulations for power electronics design and development processes.
Stats
"The models are observed to be highly accurate when compared with the simulations."
"The model files occupy 0.01% of the total physical disk space that detailed simulation and solution files typically occupy."
"A small deviation in the simulation and model temperature of the PCBA is observed."
"The calculated average error is less than 3%."