核心概念
Combining low-fidelity and high-fidelity simulation data through a novel multi-fidelity surrogate modeling approach significantly improves prediction accuracy and optimizes design parameters for temperature uniformity in electrostatic chucks, as demonstrated in an industrially relevant case study.
Wang, B., Kim, M.S., Yoon, T., Lee, D., Kim, B.S., Sung, D., & Hwang, J.T. (2024). Design optimization of semiconductor manufacturing equipment using a novel multi-fidelity surrogate modeling approach. arXiv preprint arXiv:2411.08149v1.
This paper presents a novel multi-fidelity surrogate modeling methodology for optimizing the design of electrostatic chucks (ESCs) used in semiconductor manufacturing. The primary research objective is to maximize the temperature uniformity on the wafer surface during the etching process by strategically adjusting seven key design parameters related to the coolant path and emboss contact ratios.