
This work presents the design and implementation of low-loss and broadband chip-to-package transitions for mm-Wave and sub-THz communication systems, addressing the challenges of high-frequency signal transitions between integrated circuits and packaging.


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low-loss-and-broadband-chip-to-package-transitions-for-high-frequency-communication-systems


Low-Loss and Broadband Chip-to-Package Transitions for High-Frequency Communication Systems
