
The author argues that managing heat dissipation in semiconductor transistors is crucial due to localized hotspots, proposing the use of ultrathin silicon carbide to reduce thermal boundary resistance significantly.


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Layers engineered to maximize heat flow in semiconductor devices.

Well-matched vibrations cool electronic hot spots

Efficient-Cooling-of-Electronic-Hot-Spots-with-Well-Matched-Vibrations


Efficient Cooling of Electronic Hot Spots with Well-Matched Vibrations
