サインイン
インサイト - Thermal Management
Optimized Water-Cooled Forced Convection System for High-Temperature Heat Dissipation in Hollow Cuboid Vapor Chamber
The study aimed to design and optimize a water-cooled forced convection heat dissipation system for high-temperature applications (700°K - 1000°K) using a hollow cuboid vapor chamber model. The goal was to minimize the temperature gradient across the design space to enable effective cooling.
Wick-free Vapor Chamber Enhances Cooling of High-Frequency Power Electronics
Wick-free vapor chambers with wettability-patterned surfaces can effectively cool high-frequency power electronics through passive two-phase heat transfer, outperforming traditional wick-based vapor chambers.
