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통찰 - Dielectric Image Lines
3D-Printed Dielectric Image Lines for SubTHz Chip-to-Chip Interconnects
The author presents a study on 3D-printed dielectric image lines for subTHz applications, highlighting their low-loss characteristics and ease of manufacturing.
3D-Printed Dielectric Image Lines for subTHz Chip-to-Chip Interconnects
3Dプリントされた誘電体イメージラインは、サブTHzチップ間接続のための革新的な技術を提供します。
3D-Printed Dielectric Image Lines for subTHz Chip-to-Chip Interconnects
3D-printed dielectric image lines offer low-loss transmission for subTHz applications, providing cost-effective and flexible solutions.
