
The author presents a study on 3D-printed dielectric image lines for subTHz applications, highlighting their low-loss characteristics and ease of manufacturing.


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3d-printed-dielectric-image-lines-for-subthz-chip-to-chip-interconnects


3D-Printed Dielectric Image Lines for SubTHz Chip-to-Chip Interconnects


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3Dプリントされた誘電体イメージラインは、サブTHzチップ間接続のための革新的な技術を提供します。



3D-Printed Dielectric Image Lines for subTHz Chip-to-Chip Interconnects



3D-printed dielectric image lines offer low-loss transmission for subTHz applications, providing cost-effective and flexible solutions.
